Chemical and Biomolecular Engineering Research and Publications
Title
Direct chip attachment (DCA) with electrically conductive adhesives
Document Type
Article
Date of this Version
August 1996
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
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Comments
The inventors of this patent are Booth; Richard B. (Williamson County, TX), Gaynes; Michael A. (Broome County, NY), Murco; Robert M. (Broome County, NY), Puligandla; Viswanadham (Travis County, TX), Roldan; Judith M. (Westchester County, NY), Saraf; Ravi (Lincoln , NE), Zalesinski; Jerzy M. (Crittenden County, VT) and any relevant information about this patent can be obtained from the website of united sates patent. United States Patent no 5,543,585