DigitalCommons@University of Nebraska - Lincoln

Title

Direct chip attach for low alpha emission interconnect system

Authors

Dr.Ravi Saraf, Department of Chemical Engineering, University of Nenraska-Lincoln

Document Type

Article

Date of this Version

April 1999

Comments

The inventors of this patent are :Booth; Richard B. (Williamson County, TX), Gaynes; Michael A. (Broome County, NY), Murcko; Robert M. (Broome County, NY), Puligandla; Viswanadham (Travis County, TX), Roldan; Judith M. (Westchester County, NY), Saraf; Ravi (Lincoln, NE), Zalesinski; Jerzy M. (Crittenden County, VT) . And any other relevant information about this patent can be obtained from the following link of united states patent united states patent no.5897336

An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.