Chemical and Biomolecular Engineering Research and Publications
Title
Electronic package comprising a substrate and a semiconductor device bonded thereto
Document Type
Article
Date of this Version
July 1998
A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate
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Comments
The inventors of this patent are :Angelopoulos; Marie (Cortlandt Manor, NY), Brusic; Vlasta A. (Amawalk, NY), Graham; Teresita Ordonez (Irvington, NY), Purushothaman; Sampath (Yorktown Heights, NY), Saraf; Ravi F. (Lincoln, NE), Shaw; Jane Margaret (Ridgefield, CT), Roldan; Judith Marie (Ossining, NY), Viehbeck; Alfred (Fishkill, NY)