Research Papers in Physics and Astronomy

 

Date of this Version

June 1997

Comments

IEEE Trans. On Appl. Supercond. Vol. 7, 2169(1997). Copyright 1997. Permission to use.

Abstract

Improved via connections in structures of YBa2Cu3O7-x/SrTiO3/ YBa2Cu3O7-x (YBCO/STO/YBCO) multilayers have been made using a combined HF wet-etching and ion-milling process. The critical current density Jc of the via is as high as 2×106 A/cm2 at 76 K, and is dominated by edge contacts in the ab-plane, YBCO and Sr2AlNbO6 (SAN) multilayer test circuits were also made with this process. The 4° crossovers in a SAN test chip had a critical temperature Tc of 88 K and Jc of 1.5×106 A/cm2 at 81 K, very close to those of the planar film, showing no evidence of weak links in the YBCO crossing low angle SAN steps.

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