Date of this Version
United States Patent Application Publication Majidi et al. Pub . No . : US 2019 / 0082532 A1
Disclosed herein is an efficient fabrication approach to create highly customizable wearable electronics through rapid laser machining and adhesion - controlled soft materials assembly . Well - aligned , multi - layered materials can be created from 2D and 3D elements that stretch and bend while seamlessly integrating with rigid components such as micro chip integrated circuits ( IC ) , discrete electrical components , and interconnects . These techniques are applied using commercially available materials . These materials and methods enable custom wearable electronics while offering versatility in design and functionality for a variety of bio - monitor ing applications .