Chemical and Biomolecular Engineering Research and Publications
Date of this Version
4-24-2001
Abstract
A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.
Comments
The Inventors of this patent are John Michael Cotte, New Fairfield, CT (US); Judith Marie Roldan, Ossining, NY (US); Carlos Juan Sambucetti, Croton-on-Hudson, NY (US); Ravi F. Saraf, Briarcliff Manor, NY (US). The relevant information about this patent can be obtained from the website. United States Patent No.6,221,503 B1