Chemical and Biomolecular Engineering Research and Publications
Title
Means of Seeding and Metallizing Polyimide
Document Type
Article
Date of this Version
April 2006
A method to selectively metallize polyimide with an all electroless process.
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Means of Seeding and Metallizing Polyimide
Article
April 2006
A method to selectively metallize polyimide with an all electroless process.
Comments
The Inventors of this patent are Fuad E. Doany, Katonah, NY (US); Jeffrey R. Marino, Fishkill, NY (US); Carlos J. Sambucetti, Croton-on-Hudson, NY (US); Ravi F. Saraf, Briarcliff Manor, NY (US) The relevant information about this patent can be obtained from the website. United States Patent No.7,033,648 B1