A novel multilayer circuit process using YBa2Cu3Ox /SrTiO3 thin films

Authors

• H.Q. Li, National Institute of Standards and Technology, Boulder, Colorado
• R.H. Ono, National Institute of Standards and Technology, Boulder, Colorado
• L.R. Vale, National Institute of Standards and Technology, Boulder, Colorado
• D.A. Rudman, National Institute of Standards and Technology, Boulder, Colorado
• Sy_Hwang Liou, University of Nebraska-LincolnFollow

Document Type

Article

Date of this Version

October 1996

Comments

Published by American Institute of Physics. Appl. Phys. Lett., 69, 2752 (1996). Copyright 1996. Permission to use. http://jap.aip.org/jap/.

Abstract

A process combining hydrofluoric acid (HF) and Ar⁺ ion milling has been used to make YBa₂Cu₃O_χ/SrTiO₃/YBa₂Cu₂O_χ (YBCO/STO/YBCO) multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5° steps have about the same critical temperature T_c (89–90 K) and critical current density J_c (>1X10⁶ A/cm² at 86 K) as lines on planar surfaces. Via connections have the same T_c as other circuit components and adequate critical currents for most circuit designs.