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A process combining hydrofluoric acid (HF) and Ar+ ion milling has been used to make YBa2Cu3Oχ/SrTiO3/YBa2Cu2Oχ (YBCO/STO/YBCO) multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5° steps have about the same critical temperature Tc (89–90 K) and critical current density Jc (>1X106 A/cm2 at 86 K) as lines on planar surfaces. Via connections have the same Tc as other circuit components and adequate critical currents for most circuit designs.