Chemical and Biomolecular Engineering, Department of
Department of Chemical and Biomolecular Engineering: Patents
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Date of this Version
12-7-1999
Abstract
Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer to a dielectric substrate.
Comments
The inventors of this patent are :Angelopoulos; Marie (Cortlandt Manor, NY), Brusic; Vlasta A. (Amawalk, NY), Graham; Teresita Ordonez (Irvington, NY), Purushothaman; Sampath (Yorktown Heights, NY), Saraf; Ravi F. (Lincoln, NE), Shaw; Jane Margaret (Ridgefield, CT), Roldan; Judith Marie (Ossining, NY), Viehbeck; Alfred (Fishkill, NY) Any other relevant information regarding this patent can be obtained from the following link of United States Patent no.5,997,773.