Chemical and Biomolecular Engineering Research and Publications


Date of this Version



The inventors of this patent are :Cotte; John Michael (New Fairfield, CT), Roldan; Judith Marie (Ossining, NY), Sambucetti; Carlos Juan (Croton-on-Hudson, NY), Saraf; Ravi F. (Lincoln, NE). And any other relevant information about this patent can be obtained from the following link of united states patent no 6,013,713


A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.