Chemical and Biomolecular Engineering Research and Publications


Date of this Version



The authors of this patent are :Saraf; Ravi F. (Lincoln, NE), Roldan; Judith Marie (Ossining, NY), Gaynes; Michael Anthony (Vestal, NY), Booth; Richard Benton (Pfugerville, TX), Ostrander; Steven Paul (Scotia, NY), Cooper; Emanuel I. (Riverdale, NY), Sambucetti; Carlos J. (Croton-on-Hudson, NY) and any other relevant information about this patent can be obtained from the united states patent United States Patent no 5866044


An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.