Mechanical and Materials Engineering, Department of
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Document Type
Article
Date of this Version
11-25-2014
Citation
United States Patent Patent No.: US 8,894,633 B2
Abstract
The various embodiments disclosed herein relate to modular medical devices, including various devices with detachable modular components and various devices with pivotally attached modular components. Additional embodiments relate to procedures in which various of the devices are used cooperatively. Certain embodiments of the medical devices are robotic in vivo devices.
Included in
Mechanics of Materials Commons, Nanoscience and Nanotechnology Commons, Other Engineering Science and Materials Commons, Other Mechanical Engineering Commons