Date of this Version
United States Patent Application Publication Majidi et al. Pub . No . : US 2019 / 0215965 A1
A fabrication process for soft - matter printed circuit boards is disclosed in which traces of liquid - phase Ga - In eutectic ( eGaIn ) are patterned with UV laser micromachining ( UVLM ) . The terminals of the elastomer - sealed LM circuit connect to the surface mounted chips through vertically aligned columns of eGaIn - coated ferromagnetic micro spheres that are embedded within an interfacial elastomer layer .