A novel multilayer circuit process using YBa2Cu3Ox /SrTiO3 thin films

Authors

H.Q. Li, National Institute of Standards and Technology, Boulder, Colorado
R.H. Ono, National Institute of Standards and Technology, Boulder, Colorado
L.R. Vale, National Institute of Standards and Technology, Boulder, Colorado
D.A. Rudman, National Institute of Standards and Technology, Boulder, Colorado
Sy_Hwang Liou, University of Nebraska-LincolnFollow

Date of this Version

October 1996

Comments

Published by American Institute of Physics. Appl. Phys. Lett., 69, 2752 (1996). Copyright 1996. Permission to use. http://jap.aip.org/jap/.

Abstract

A process combining hydrofluoric acid (HF) and Ar⁺ ion milling has been used to make YBa₂Cu₃O_χ/SrTiO₃/YBa₂Cu₂O_χ (YBCO/STO/YBCO) multilayer test circuits. Low-angle steps can be readily etched in STO and YBCO films with this process. YBCO lines crossing 5° steps have about the same critical temperature T_c (89–90 K) and critical current density J_c (>1X10⁶ A/cm² at 86 K) as lines on planar surfaces. Via connections have the same T_c as other circuit components and adequate critical currents for most circuit designs.