Direct chip attachment (DCA) with electrically conductive adhesives

Authors

Ravi F. Saraf, University of Nebraska-LincolnFollow

Date of this Version

8-6-1996

Comments

The inventors of this patent are Booth; Richard B. (Williamson County, TX), Gaynes; Michael A. (Broome County, NY), Murco; Robert M. (Broome County, NY), Puligandla; Viswanadham (Travis County, TX), Roldan; Judith M. (Westchester County, NY), Saraf; Ravi (Lincoln , NE), Zalesinski; Jerzy M. (Crittenden County, VT) and any relevant information about this patent can be obtained from the website of united sates patent. United States Patent no 5,543,585

Abstract

A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.