Chemical and Biomolecular Engineering Research and Publications
Date of this Version
8-13-1996
Abstract
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
Comments
The inventors of this invention are Booth; Richard B. (Pfugerville, TX), Cooper; Emanuel I. (Riverdale, NY), Giess; Edward A. (Mooresville, SC), Kordus; Mark R. (Ninety-Six, SC), Krongelb; Sol (Katonah, NY), Ostrander; Steven P. (Scotia, NY), Roldan; Judith M. (Ossining, NY), Sambucetti; Carlos J. (Croton-on-Hudson, NY), Saraf; Ravi (Lincoln,NE) .Any other relevant information about this paten can be obtained from the following link of united states patent. United States patent no 5,545,429