Chemical and Biomolecular Engineering, Department of
Department of Chemical and Biomolecular Engineering: Patents
Accessibility Remediation
If you are unable to use this item in its current form due to accessibility barriers, you may request remediation through our remediation request form.
Date of this Version
8-13-1996
Abstract
The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.
Comments
The inventors of this invention are Booth; Richard B. (Pfugerville, TX), Cooper; Emanuel I. (Riverdale, NY), Giess; Edward A. (Mooresville, SC), Kordus; Mark R. (Ninety-Six, SC), Krongelb; Sol (Katonah, NY), Ostrander; Steven P. (Scotia, NY), Roldan; Judith M. (Ossining, NY), Sambucetti; Carlos J. (Croton-on-Hudson, NY), Saraf; Ravi (Lincoln,NE) .Any other relevant information about this paten can be obtained from the following link of united states patent. United States patent no 5,545,429