Heat Curing of Soy Protein Films at Selected Temperatures and Pressures

Authors

Ki Myong Kim, University of Nebraska-Lincoln
Curtis Weller, University of Nebraska-LincolnFollow
Milford Hanna, University of Nebraska-LincolnFollow
Aristippos Gennadios, Banner Pharmacaps Inc.Follow

Document Type

Article

Date of this Version

2002

Comments

Published in Lebensmittel-Wissenschaft und-Technologie 35 (2002), pp. 140–145.
Copyright © 2002 Elsevier Science Ltd. Used by permission.

Abstract

Vacuum and temperature effects on moisture content, water vapor permeability (WVP), color (L, a, b, and DE), tensile strength (TS), elongation (E), and total soluble matter (TSM) of soy protein isolate (SPI) films were examined. SPI films were cured at 60, 72.5, or 85 °C and at 101.3, 81.32, or 61.32 kPa for 24 h. As a result of heat-curing moisture content, WVP, E, and TSM decreased, and total color difference and TS increased. Pressure, individually and interactively with temperature, significantly affected film moisture content, TS, and TSM.