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Diamond and Copper Bonding by Carbide Interface Materials for Electronic Packaging Thermal Management
Abstract
Microelectronics innovate and advance technology to new limits every day. Microelectronics are in everything around us such as cellphones, computers, watches, glasses and more. As these electronics get smaller and more advanced, they run into limits that challenge their development. One such limit is thermal heat dissipation. The thermal effects come from the natural function of electronics, the loss of power, which converts to heat in the system. This heat needs to be removed for optimal function of the devices. If the heat continues to generate and does not get removed fast enough, the device can experience loss of efficiency and possibly component failure. Thermal management is key for devices in today’s world. For these electronics to continue to perform well and technologies to advance, thermal management remains an important part of system design. There are several methods for managing heat of a system. Most methods for thermal management are large. Heat sinks, heat fins, liquid cooling, and such technologies are popular for large systems that generate heat. With electronics getting smaller, another method for thermal management is localized systems. This design would have the thermal management device close to the chip generating the heat and reduce the thermal stress on the chip while allowing the heat to dissipate elsewhere more slowly. Diamond is a very efficient thermal management material. It boasts the highest thermal conductivity of known materials. At approximately 2200 W/m·K it is about 5 times larger than copper which is about 398 W/m·K. Diamond’s heat capacity is about 4 times lower than copper at 6.115 vs 24.47 (J/mol·K) respectively This work looks at diamond and copper composites for localized thermal management. Carbide interphase mechanics will be used to reduce the large difference in the coefficient for thermal expansion (CTE) between diamond and electronic materials and help diamond interface better with other materials since diamond is inert. Femtosecond lasers were a key part of this research and work with the system is also explored for its versatility in assisting diamond integration with packaging materials.
Subject Area
Materials science|Thermodynamics
Recommended Citation
Carlson, Timothy D, "Diamond and Copper Bonding by Carbide Interface Materials for Electronic Packaging Thermal Management" (2023). ETD collection for University of Nebraska-Lincoln. AAI30575789.
https://digitalcommons.unl.edu/dissertations/AAI30575789