An improved multi-layer fabrication process for YBa₂Cu₃O_7-x-based circuits

Authors

H.Q. Li, Nat. Inst. of Stand. & Technol., Boulder, Colorado
R.H. Ono, Nat. Inst. of Stand. & Technol., Boulder, Colorado
L.R. Vale, Nat. Inst. of Stand. & Technol., Boulder, Colorado
D.A. Rudman, Nat. Inst. of Stand. & Technol., Boulder, Colorado
Sy_Hwang Liou, University of Nebraska-LincolnFollow
W.H. Mallison, Nat. Inst. of Stand. & Technol., Boulder, Colorado

Date of this Version

June 1997

Comments

IEEE Trans. On Appl. Supercond. Vol. 7, 2169(1997). Copyright 1997. Permission to use.

Abstract

Improved via connections in structures of YBa₂Cu₃O_7-x/SrTiO₃/ YBa₂Cu₃O_7-x (YBCO/STO/YBCO) multilayers have been made using a combined HF wet-etching and ion-milling process. The critical current density J_c of the via is as high as 2×10⁶ A/cm² at 76 K, and is dominated by edge contacts in the ab-plane, YBCO and Sr₂AlNbO₆ (SAN) multilayer test circuits were also made with this process. The 4° crossovers in a SAN test chip had a critical temperature T_c of 88 K and J_c of 1.5×10⁶ A/cm² at 81 K, very close to those of the planar film, showing no evidence of weak links in the YBCO crossing low angle SAN steps.