Mechanical & Materials Engineering, Department of
Date of this Version
7-10-2018
Citation
United States Patent Patent No.:US 10,020,010 B1
Abstract
A thermomechanical memory / logic device is disclosed . In embodiments , the thermomechanical device includes a first thermally controlled terminal ( e . g . , hot terminal ) ; a second thermally controlled terminal ( e . g . , cool terminal / base ) ; a stem or other structure that can be thermally expanded connected to the cool terminal ; and a thermal conductive head coupled to the stem . The head can exchange heat with the hot terminal . The stem and head are between the first thermally controlled terminal and the second thermally controlled terminal , wherein the stem expands or contracts in response to heat absorbed or given off by the thermal conductive head , causing the head to move towards the first thermally controlled terminal or towards the second thermally controlled terminal until a stable state is reached . For example , bistable thermal states can be used to implement logic states ( e . g . , ZERO or ONE states )
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Mechanics of Materials Commons, Nanoscience and Nanotechnology Commons, Other Engineering Science and Materials Commons, Other Mechanical Engineering Commons